Gas sensors boosted by two-dimensional h-BN enabled transfer on thin substrate foils: towards wearable and portable applications T Ayari, C Bishop, MB Jordan, S Sundaram, X Li, S Alam, Y ElGmili, ... Scientific reports 7 (1), 15212, 2017 | 67 | 2017 |
Flexible metal-semiconductor-metal device prototype on wafer-scale thick boron nitride layers grown by MOVPE X Li, MB Jordan, T Ayari, S Sundaram, Y El Gmili, S Alam, M Alam, ... Scientific reports 7 (1), 786, 2017 | 52 | 2017 |
Development of seed layer for electrodeposition of copper on carbon nanotube bundles MB Jordan, Y Feng, SL Burkett Journal of Vacuum Science & Technology B 33 (2), 2015 | 44 | 2015 |
Tutorial on forming through-silicon vias SL Burkett, MB Jordan, RP Schmitt, LA Menk, AE Hollowell Journal of Vacuum Science & Technology A 38 (3), 2020 | 39 | 2020 |
Improving InGaN heterojunction solar cells efficiency using a semibulk absorber M Arif, W Elhuni, J Streque, S Sundaram, S Belahsene, Y El Gmili, ... Solar Energy Materials and Solar Cells 159, 405-411, 2017 | 32 | 2017 |
Heterogeneous integration of thin-film InGaN-based solar cells on foreign substrates with enhanced performance T Ayari, S Sundaram, X Li, S Alam, C Bishop, W El Huni, MB Jordan, ... ACS photonics 5 (8), 3003-3008, 2018 | 23 | 2018 |
Sub-10µm pitch hybrid direct bond interconnect development for die-to-die hybridization JP Mudrick, JA Sierra-Suarez, MB Jordan, TA Friedmann, R Jarecki, ... 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 648-654, 2019 | 20 | 2019 |
Nanoselective area growth of GaN by metalorganic vapor phase epitaxy on 4H-SiC using epitaxial graphene as a mask R Puybaret, G Patriarche, MB Jordan, S Sundaram, Y El Gmili, ... Applied Physics Letters 108 (10), 2016 | 20 | 2016 |
Antenna-integrated, die-embedded glass package for 6G wireless applications X Jia, X Li, K Moon, JW Kim, KQ Huang, MB Jordan, M Swaminathan 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 377-383, 2022 | 14 | 2022 |
Void-free copper electrodeposition in high aspect ratio, full wafer thickness through-silicon vias with endpoint detection RP Schmitt, LA Menk, E Baca, JE Bower, JA Romero, MB Jordan, ... Journal of The Electrochemical Society 167 (16), 162517, 2021 | 14 | 2021 |
Nanopyramid-based absorber to boost the efficiency of InGaN solar cells W El Huni, S Karrakchou, Y Halfaya, M Arif, MB Jordan, R Puybaret, ... Solar Energy 190, 93-103, 2019 | 14 | 2019 |
Role of V-pits in the performance improvement of InGaN solar cells M Arif, JP Salvestrini, J Streque, MB Jordan, Y El Gmili, S Sundaram, X Li, ... Applied Physics Letters 109 (13), 2016 | 12 | 2016 |
Ratio data: Understanding pitfalls and knowing when to standardise C Bishop, I Shrier, M Jordan Symmetry 15 (2), 318, 2023 | 11 | 2023 |
Antenna with embedded die in glass interposer for 6g wireless applications X Jia, X Li, S Erdogan, KS Moon, JW Kim, KQ Huang, MB Jordan, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 13 …, 2023 | 10 | 2023 |
Sampling methods CM Bishop, M Jordan, J Kleinberg, B Schölkopf Pattern recognition and machine learning, 2006 | 8 | 2006 |
Focused ion beam preparation of low melting point metals: Lessons learned from indium JR Michael, DL Perry, DP Cummings, JA Walraven, MB Jordan Microscopy and Microanalysis 28 (3), 603-610, 2022 | 6 | 2022 |
Analyzing the behavior and shear strength of common adhesives used in temporary wafer bonding JA Sharpe, MB Jordan, SL Burkett, ME Barkey 2013 IEEE 63rd Electronic Components and Technology Conference, 94-100, 2013 | 6 | 2013 |
Strategies relating to CMP for die to wafer interconnects utilizing hybrid direct bonding JAS Suarez, JP Mudrick, CC Sennett, TA Friedmann, S Arterburn, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1950-1956, 2020 | 4 | 2020 |
Die-Embedded Glass Interposer with Minimum Warpage for 5G/6G Applications X Li, X Jia, JW Kim, KS Moon, MB Jordan, M Swaminathan 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2247-2254, 2023 | 2 | 2023 |
Die Level Microbumping and Flip Chip Bonding for MPW Die. AE Hollowell, E Baca, M Jordan, JR Pillars, C Michael Sandia National Lab.(SNL-NM), Albuquerque, NM (United States), 2019 | 2 | 2019 |