Numerical simulations of fast crack growth in brittle solids XP Xu, A Needleman Journal of the Mechanics and Physics of Solids 42 (9), 1397-1434, 1994 | 3041 | 1994 |
Void nucleation by inclusion debonding in a crystal matrix X Xu, A Needleman Modelling and Simulation in Materials Science and Engineering 1, 111, 1993 | 974 | 1993 |
Numerical simulations of dynamic crack growth along an interface XP Xu, A Needleman International journal of fracture 74, 289-324, 1996 | 310 | 1996 |
A molecular dynamics investigation of rapid fracture mechanics FF Abraham, D Brodbeck, WE Rudge, X Xu Journal of the Mechanics and Physics of Solids 45 (9), 1595-1619, 1997 | 170 | 1997 |
Performanace and reliability analysis of 3D-integration structures employing through silicon via (TSV) AP Karmarkar, X Xu, V Moroz 2009 IEEE International Reliability Physics Symposium, 682-687, 2009 | 157 | 2009 |
Numerical simulations of dynamic interfacial crack growth allowing for crack growth away from the bond line XP Xu, A Needleman International Journal of Fracture 74 (3), 253-275, 1995 | 139 | 1995 |
pMOSFET with 200% mobility enhancement induced by multiple stressors L Washington, F Nouri, S Thirupapuliyur, G Eneman, P Verheyen, ... Electron Device Letters, IEEE 27 (6), 511-513, 2006 | 92 | 2006 |
Analyzing strained-silicon options for stress-engineering transistors V Moroz, X Xu, D Pramanik, F Nouri, Z Krivokapic Solid State Technology 47 (7), 49-52, 2004 | 74 | 2004 |
A systematic study of trade-offs in engineering a locally strained pMOSFET F Nouri, P Verheyen, L Washington, V Moroz, I De Wolf, M Kawaguchi, ... IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004 …, 2004 | 71 | 2004 |
Modeling the impact of stress on silicon processes and devices V Moroz, N Strecker, X Xu, L Smith, I Bork Materials Science in Semiconductor Processing 6 (1-3), 27-36, 2003 | 63 | 2003 |
Design Automation and TCAD Tool Solutions for Through Silicon Via-Based 3D IC Stack J Kawa, X Xu 3D IC Stacking Technology, 77-111, 2011 | 50* | 2011 |
Method and apparatus for placing transistors in proximity to through-silicon vias J Sproch, V Moroz, X Xu, Karmarkar, Aditya US Patent 8,362,622, 2013 | 46* | 2013 |
The impact of layout on stress-enhanced transistor performance V Moroz, G Eneman, P Verheyen, F Nouri, L Washington, L Smith, ... 2005 International Conference On Simulation of Semiconductor Processes and …, 2005 | 46 | 2005 |
Stress and strain fields at the tip of a sharp V-notch in a power-hardening material ZB Kuang, XP Xu International Journal of Fracture 35, 39-53, 1987 | 44 | 1987 |
Simulation methodology and flow integration for 3D IC stress management M Nakamoto, R Radojcic, W Zhao, V Kumar, A Karmarkar, X Xu IEEE Custom Integrated Circuits Conference 2010, 1-4, 2010 | 42 | 2010 |
Through-silicon-via technology for 3D integration J Dukovic, S Ramaswami, S Pamarthy, R Yalamanchili, N Rajagopalan, ... Memory Workshop (IMW), 2010 IEEE International, 1-2, 2010 | 41 | 2010 |
Effect of inhomogeneities on dynamic crack growth in an elastic solid XP Xu, A Needleman, FF Abraham Modelling and Simulation in Materials Science and Engineering 5 (5), 489, 1997 | 39 | 1997 |
Elastic anisotropy of Cu and its impact on stress management for 3D IC: Nanoindentation and TCAD simulation study KB Yeap, E Zschech, UD Hangen, T Wyrobek, LW Kong, A Karmakar, ... Journal of Materials Research 27 (1), 339-348, 2012 | 29 | 2012 |
Material, process and geometry effects on through-silicon via reliability and isolation AP Karmarkar, X Xu, S Ramaswami, J Dukovic, K Sapre, A Bhatnagar MRS Online Proceedings Library (OPL) 1249, 1249-F09-08, 2010 | 26 | 2010 |
Dithienothiapyran: an excellent donor block for building high-performance copolymers in nonfullerene polymer solar cells M Deng, X Xu, YW Lee, HY Woo, Z Bi, W Ma, Y Li, Q Peng ACS applied materials & interfaces 11 (3), 3308-3316, 2018 | 23 | 2018 |