Articles with public access mandates - Md Emran Hossain BhuiyanLearn more
Available somewhere: 6
A hybrid process for printing pure and high conductivity nanocrystalline copper and nickel on flexible polymeric substrates
MEH Bhuiyan, A Behroozfar, S Daryadel, S Moreno, S Morsali, ...
Scientific reports 9 (1), 19032, 2019
Mandates: US National Science Foundation, US Department of Defense, US National …
Direct-write printing copper–nickel (Cu/Ni) alloy with controlled composition from a single electrolyte using co-electrodeposition
C Wang, ME Hossain Bhuiyan, S Moreno, M Minary-Jolandan
ACS applied materials & interfaces 12 (16), 18683-18691, 2020
Mandates: US National Science Foundation, US Department of Energy, US Department of …
Interconnect fabrication by electroless plating on 3D-printed electroplated patterns
ME Hossain Bhuiyan, S Moreno, C Wang, M Minary-Jolandan
ACS Applied Materials & Interfaces 13 (16), 19271-19281, 2021
Mandates: US National Science Foundation, US Department of Energy
Additive printing of pure nanocrystalline nickel thin films using room environment electroplating
A Behroozfar, MEH Bhuiyan, S Daryadel, D Edwards, BJ Rodriguez, ...
Nanotechnology 31 (5), 055301, 2019
Mandates: US National Science Foundation, US Department of Defense, Science Foundation …
Electrical property-microstructure of copper interconnects printed by localized pulsed electrodeposition (L-PED)
MEH Bhuiyan, C Wang, MJ Arellano-Jimenez, M Waliullah, ...
Materials Letters 330, 133364, 2023
Mandates: US National Science Foundation
Computational analysis of copper electrodeposition into a porous preform
ME Hossain Bhuiyan, M Minary-Jolandan
AIP Advances 12 (5), 2022
Mandates: US National Science Foundation, US Department of Defense
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