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Co-authors
- Yongfeng MeiFudan UniversityVerified email at fudan.edu.cn
- Paul K ChuChair Professor of Materials Engineering, City University of Hong KongVerified email at cityu.edu.hk
- Fei DingVerified email at umich.edu
- Yang liwenFaculty of Materials and Optoelectronic Physics, Xiangtan UniversityVerified email at xtu.edu.cn
- Yingchun ChengNanjing Tech University; University of Illinois Chicago; KAUST; Nanjing UniversityVerified email at njtech.edu.cn
- Esteban Bermúdez-UreñaVisiting professor, Universidad de Costa RicaVerified email at ucr.ac.cr
- Ricky FuPlasma Technology Limited / City University of Hong KongVerified email at cityu.edu.hk
- Suwit KiravittayaDepartment of Electrical Engineering, Faculty of Engineering, Chulalongkorn UniversityVerified email at chula.ac.th
- Tianrong ZhanVerified email at udel.edu
- Yajun GaoKAUSTVerified email at kaust.edu.sa
- Joseph WangUniversity California San DiegoVerified email at ucsd.edu
- Armando RastelliProfessor of Semiconductor Physics, Johannes Kepler University LinzVerified email at jku.at
- Xuanyong LiuProfessor of Shanghai Institute of Ceramics, Chinese Academy of SciencesVerified email at mail.sic.ac.cn
- Stefan M. HarazimGLOBALFOUNDRIES Dresden Module One LLC & Co KG
- Vladimir A. Bolaños QuiñonesSemiconductor Industry