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Soung Chang LiewThe Chinese University of Hong KongVerified email at ie.cuhk.edu.hk
Taotao WangShenzhen UniversityVerified email at szu.edu.cn
Lu LuUniversity of Chinese Academy of SciencesVerified email at csu.ac.cn
Daquan FengShenzhen UniversityVerified email at szu.edu.cn
Shi JinSoutheast UniversityVerified email at seu.edu.cn
Xiaoxiao WuVerified email at szu.edu.cn
Qing YANGCollege of Electronics and Information Engineering, Shenzhen UniversityVerified email at szu.edu.cn
Mugen PengBeijing University of Posts & Telecommun., IEEE Fellow, Web of Science Highly Cited ResearcherVerified email at bupt.edu.cn
Caihong KaiHefei University of TechnologyVerified email at hfut.edu.cn
Xiang-Gen XiaDepartment of Electrical and Computer Engineering, University of Delaware, Newark, DE 19716, USAVerified email at ee.udel.edu
Mohamed ElwekeilFaculty of Electronic Engineering, Menoufia UniversityVerified email at el-eng.menofia.edu.eg
Wei ZhangProfessor, School of EET, University of New South Wales, Sydney, AustraliaVerified email at unsw.edu.au
George K. KaragiannidisAristotle University of Thessaloniki, GreeceVerified email at auth.gr
Ning XieShenzhen UniversityVerified email at szu.edu.cn
Chongtao Guo (郭重涛)Shenzhen University, Shenzhen, ChinaVerified email at szu.edu.cn
Yu ZhuFudan UniversityVerified email at fudan.edu.cn
Xiaoli MaProfessor of ECE, Georgia TechVerified email at gatech.edu
Lingyang SongPeking University & Peng Cheng Laboratory, ChinaVerified email at pku.edu.cn
Khaled B. LetaiefMember of US National Academy of Engineering and New Bright Professor of Engineering, HKUSTVerified email at ust.hk
Hui GaoBeijing University of Posts and TelecommunicationsVerified email at bupt.edu.cn
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shengli zhang
shenzhen university, university of science and technology of china, chinese university of hong kong
Verified email at szu.edu.cn