| Bonding technology based on solid porous Ag for large area chips C Chen, S Noh, H Zhang, C Choe, J Jiu, S Nagao, K Suganuma Scripta Materialia 146, 123-127, 2018 | 65 | 2018 |
| Low-stress design of bonding structure and its thermal shock performance (− 50 to 250° C) in SiC/DBC power die-attached modules C Chen, C Choe, Z Zhang, D Kim, K Suganuma Journal of Materials Science: Materials in Electronics 29 (16), 14335-14346, 2018 | 39 | 2018 |
| Damage evaluation in lithium cobalt oxide/carbon electrodes of secondary battery by acoustic emission monitoring CY Choe, WS Jung, JW Byeon Materials Transactions 56 (2), 269-273, 2015 | 31 | 2015 |
| Heat-resistant die-attach with cold-rolled Ag sheet S Noh, C Choe, C Chen, K Suganuma Applied Physics Express 11 (1), 016501, 2017 | 26 | 2017 |
| Development of thermal shock-resistant of GaN/DBC die-attached module by using Ag sinter paste and thermal stress relaxation structure D Kim, C Chen, A Suetake, C Choe, T Sugahara, S Nagao, K Suganuma Microelectronics Reliability 88, 779-787, 2018 | 21 | 2018 |
| Low temperature low pressure solid-state porous Ag bonding for large area and its high-reliability design in die-attached power modules C Chen, D Kim, Z Wang, Z Zhang, Y Gao, C Choe, K Suganuma Ceramics International, 2018 | 20 | 2018 |
| Influence of thermal exposure upon mechanical/electrical properties and microstructure of sintered micro-porous silver C Choe, S Noh, C Chen, D Kim, K Suganuma Microelectronics Reliability 88, 695-700, 2018 | 19 | 2018 |
| Printed wire interconnection using Ag sinter paste for wide band gap power semiconductors S Noh, C Choe, C Chen, H Zhang, K Suganuma Journal of Materials Science: Materials in Electronics 29 (17), 15223-15232, 2018 | 9 | 2018 |
| Real-time Monitoring of Degradation of Zirconia Ceramic by Acoustic Emission KG Wu, CY Choe, SM Lee, J Yoo, CY Hyun, DP Hong, JW Byeon Applied Mechanics and Materials 433, 816-820, 2013 | 4 | 2013 |
