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- Nanjian WuInstitute of SemiconductorsVerified email at red.semi.ac.cn
- Patrick ChiangProfessor of Electrical and Computer Engineering, Fudan UniversityVerified email at fudan.edu.cn
- Xi XiaoChina Inform. and Comm. Techn. Group Corporation (CICT);Peng Cheng Laboratory (PCL)Verified email at wri.com.cn
- Binhao WangXi'an Institute of Optics and Precision Mechanics, Chinese Academy of SciencesVerified email at opt.ac.cn
- Shang HuHuawei TechnologiesVerified email at hisilicon.com
- Marco FiorentinoReasearcher, HPE LabsVerified email at hpe.com
- Rui BaiOregon State UniversityVerified email at eecs.oregonstate.edu
- Qiwen LiaoInstitute of Semiconductors, Chinese Academy of SciencesVerified email at semi.ac.cn
- LI CHENGvisionICsVerified email at evisionics.com
- Yang XuGraduate Student of Electrical Engineering, Columbia UniversityVerified email at columbia.edu
- Kunzhi YuvisionICsVerified email at tamu.edu
- Yang XuTexas Instruments; Oregon State University; Tsinghua UniversityVerified email at eecs.oregonstate.edu
- Samuel PalermoTexas A&M UniversityVerified email at ece.tamu.edu
- Hao LiNvidiaVerified email at nvidia.com
- Zhe XuanIntel CorporationVerified email at intel.com
- Woogeun RheeProfessor, Tsinghua UniversityVerified email at tsinghua.edu.cn
- Jiao ChengMaxim IntegratedVerified email at maximintegrated.com