| Method of processing a high voltage p++/n-well junction and a device manufactured by the method M Vermandel, A Van Calster, P Moens, H Van Hove, M Tack US Patent App. 09/950,835, 2002 | 133 | 2002 |
| A Comparison Between Silicon Nitride Films Made by PCVD of N 2‐SiH4/Ar and N 2‐SiH4/He K Allaert, A Van Calster, H Loos, A Lequesne Journal of the Electrochemical Society 132 (7), 1763, 1985 | 94 | 1985 |
| Polycrystalline CdSe films for thin film transistors A Van Calster, A Vervaet, I De Rycke, J De Baets, J Vanfleteren Journal of Crystal Growth 86 (1-4), 924-928, 1988 | 83 | 1988 |
| Influence of chemical pretreatment of epoxy polymers on the adhesion strength of electrochemically deposited Cu for use in electronic interconnections S Siau, A Vervaet, E Schacht, A Van Calster Journal of the Electrochemical Society 151 (2), C133, 2004 | 61 | 2004 |
| Adhesion strength of the epoxy polymer/copper interface for use in microelectronics S Siau, A Vervaet, L Van Vaeck, E Schacht, U Demeter, A Van Calster Journal of the electrochemical society 152 (6), C442, 2005 | 54 | 2005 |
| Epoxy polymer surface modification through wet-chemical organic surface synthesis for adhesion improvement in microelectronics S Siau, A Vervaet, E Schacht, U Demeter, A Van Calster Thin Solid Films 495 (1-2), 348-356, 2006 | 44 | 2006 |
| Design, fabrication and evaluation of a high-performance XGA VAN-LCOS microdisplay H De Smet, D Cuypers, A Van Calster, J Van den Steen, ... Displays 23 (3), 89-98, 2002 | 43 | 2002 |
| Method for measuring the cell gap in liquid-crystal displays F Bruyneel, H De Smet, J Vanfleteren, A Van Calster Optical Engineering 40 (2), 259-267, 2001 | 43 | 2001 |
| Influence of wet chemical treatments on the evolution of epoxy polymer layer surface roughness for use as a build-up layer S Siau, A Vervaet, A Van Calster, I Swennen, E Schacht Applied surface science 237 (1-4), 457-462, 2004 | 42 | 2004 |
| Stabilizer concentration and local environment: Their effects on electroless nickel plating of PCB micropads S Zhang, J De Baets, M Vereeken, A Vervaet, A Van Calster Journal of the Electrochemical Society 146 (8), 2870, 1999 | 42 | 1999 |
| Kinetic study of wet chemical treatments on the surface roughness of epoxy polymer layers for buildup layers: I. Sweller influence S Siau, A Vervaet, S Nalines, E Schacht, A Van Calster Journal of the Electrochemical Society 151 (12), C816, 2004 | 39 | 2004 |
| Kinetic study of wet chemical treatments on the surface roughness of epoxy polymer layers for buildup layers: II. Oxidative Treatment of the surface S Siau, A Vervaet, S Nalines, E Schacht, A Van Calster Journal of the Electrochemical Society 151 (12), C831, 2004 | 39 | 2004 |
| On the field effect in polycrystalline CdSe thin‐film transistors A Van Calster, J Vanfleteren, I De Rycke, J De Baets Journal of applied physics 64 (6), 3282-3286, 1988 | 39 | 1988 |
| VAN LCOS microdisplays: A decade of technological evolution D Cuypers, H De Smet, A Van Calster Journal of Display Technology 7 (3), 127-134, 2011 | 37 | 2011 |
| Introduction of amino groups on the surface of thin photo definable epoxy resin layers via chemical modification D Schaubroeck, J De Baets, T Desmet, S Van Vlierberghe, E Schacht, ... Applied Surface Science 255 (21), 8780-8787, 2009 | 37 | 2009 |
| A versatile micropower high-voltage flat-panel display driver in a 100-V 0.7-/spl mu/m CMOS intelligent interface technology J Doutreloigne, H De Smet, A Van Calster IEEE Journal of Solid-State Circuits 36 (12), 2039-2048, 2001 | 32 | 2001 |
| Surface modification of a photo-definable epoxy resin with polydopamine to improve adhesion with electroless deposited copper D Schaubroeck, E Van Den Eeckhout, J De Baets, P Dubruel, ... Journal of adhesion science and technology 26 (18-19), 2301-2314, 2012 | 31 | 2012 |
| The measuring of 1/f noise of thick and thin film resistors S Demolder, M Vandendriessche, A Van Calster Journal of Physics E: Scientific Instruments 13 (12), 1323, 1980 | 29 | 1980 |
| Surface modification of an epoxy resin with polyamines via cyanuric chloride coupling D Schaubroeck, J De Baets, T Desmet, P Dubruel, E Schacht, ... Applied Surface Science 256 (21), 6269-6278, 2010 | 28 | 2010 |
| Qualitative electroless Ni/Au plating considerations for the solder mask on top of sequential build-up layers S Siau, A Vervaet, L Degrendele, J De Baets, A Van Calster Applied surface science 252 (8), 2717-2740, 2006 | 26 | 2006 |
