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Omer G MemisIntel CorporationVerified email at intel.com
Alireza BonakdarNorthwestern UniversityVerified email at u.northwestern.edu
Manijeh RazeghiNorthwestern UniversityVerified email at eecs.northwestern.edu
Wei WuMeta Reality LabVerified email at fb.com
Dibyendu DeyEngineer at Microsoft CorporationVerified email at intel.com
Ryan GelfandCREOL, UCFVerified email at u.northwestern.edu
Vala FathipourUniversity of California BerkeleyVerified email at berkeley.edu
John KohoutekIndustryVerified email at u.northwestern.edu
Iman Hassani niaNorthwestern UniversityVerified email at u.northwestern.edu
Mohsen RezaeiNorthwestern UniversityVerified email at u.northwestern.edu
Sung Jun JangNorthwestern UniversityVerified email at northwestern.edu
Simone BianconiPostdoctoral Fellow, Ecole Polytechnique Federale de Lausanne (EPFL)Verified email at epfl.ch
CHEE LEONG TANNanjing University of Posts and TelecommunicationsVerified email at njupt.edu.cn
Gail J BrownAir Force Research LaboratoryVerified email at us.af.mil
Min-Su ParkDong-A UniversityVerified email at dau.ac.kr
Kang L. WangElectrical Engineering DepartmentVerified email at ee.ucla.edu
Soon-Cheol KongRiverside Research InstituteVerified email at riversideresearch.org
Ilesanmi AdesidaNazarbayev University and University of IllinoisVerified email at nu.edu.kz
Alok TayiPostdoctoral Fellow, Harvard UniversityVerified email at fas.harvard.edu
Shuang ZhangChair Professor, University of Hong Kong;Verified email at hku.hk