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Nenad MiljkovicUniversity of Illinois at Urbana-ChampaignVerified email at illinois.edu
Xiao Yan (颜笑)Chongqing UniversityVerified email at cqu.edu.cn
Daejoong KimSogang UniversityVerified email at sogang.ac.kr
Soumyadip SettAssistant Professor, Indian Institute of Technology GandhinagarVerified email at iitgn.ac.in
Kazi Fazle RabbiUniversity of illinois at Urbana-ChampaignVerified email at illinois.edu
Kilsung KwonKorea Atomic Energy Research InstituteVerified email at kaeri.re.kr
Muhammad Jahidul HoqueUniversity of Illinois Urbana ChampaignVerified email at illinois.edu
Hyeongyun ChaUniversity at Buffalo, The State University of New YorkVerified email at buffalo.edu
Junho OhDepartment of Mechanical Engineering, Hanyang University ERICAVerified email at hanyang.ac.kr
Seungjun LeeUniversity of Illinois Urbana ChampaignVerified email at illinois.edu
Jingcheng MaAssistant Professor, the University of Notre DameVerified email at nd.edu
Siavash KhodakaramiUniversity of Illinois at Urbana-ChampaignVerified email at illinois.edu
Chongyan ZhaoTsinghua UniversityVerified email at mails.tsinghua.edu.cn
Kalyan BoyinaTrane TechnologiesVerified email at illinois.edu
Thomas FoulkesFounder of Pacergy and Innovation Crossroads Entrepreneurial Fellow at Oak Ridge National LabVerified email at pacergy.com
Peter SokalskiUniversity of Texas at AustinVerified email at utexas.edu
Jie FengAssistant Professor, Mechanical Science and Engineering, University of Illinois at Urbana-ChampaignVerified email at illinois.edu
Sanjiv SinhaAsst. Professor of Mechanical Engineering, University of IllinoisVerified email at illinois.edu
Chenhui ShaoAssociate Professor, Mechanical Engineering, University of Michigan, Ann ArborVerified email at umich.edu
Manjunath C RajagopalIntel Corporation, University of Illinois at Urbana-Champaign.Verified email at intel.com