Douglas C.H. Yu

Douglas CH Yu

Taiwan Semiconductor Manufacturing Company Ltd.
Email yang diverifikasi di tsmc.com
Dirujuk 49477 kali
packaging 3D microelectronics interconnect semiconductor
Rafael Auras

Rafael Auras

Professor, School of Packaging, Michigan State University
Email yang diverifikasi di msu.edu
Dirujuk 23237 kali
polymers poly(lactic acid) packaging biodegradation life cycle assessment
joy laskar

joy laskar

georgia tech, majasystems
Email yang diverifikasi di majasystems.com
Dirujuk 17517 kali
electrical engineering rf mmW packaging
Madhusudan K Iyengar

Madhusudan K Iyengar

Google
Email yang diverifikasi di google.com
Dirujuk 17144 kali
computer architecture thermal management data centers packaging energy efficiency
SUBRAMANIAN S. IYER

SUBRAMANIAN S. IYER

University of California at Los Angeles,
Email yang diverifikasi di g.ucla.edu
Dirujuk 17052 kali
Microelectronics System Integration Packaging neuromorphic computing
jone carter

jone carter

Dirujuk 15001 kali
packaging
Tadatomo Suga

Tadatomo Suga

Meisei University
Email yang diverifikasi di gakushikai.jp
Dirujuk 14549 kali
bonding packaging interface integration
L-T. Lim

LT. Lim

Department of Food Science, University of Guelph
Email yang diverifikasi di uoguelph.ca
Dirujuk 14368 kali
film fiber packaging food electrospinning
Rick Schifferstein

Rick Schifferstein

Associate Professor TU Delft
Email yang diverifikasi di tudelft.nl
Dirujuk 13463 kali
Food Design Eating behaviour Packaging Experience
Pierre Chandon

Pierre Chandon

L'Oréal Chaired Professor of Marketing, INSEAD
Email yang diverifikasi di insead.edu
Dirujuk 13315 kali
marketing consumer behavior nudging food packaging
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