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- Joanna AizenbergHarvard UniversityEmail verificata su seas.harvard.edu
- Tak-Sing WongProfessor of Mechanical Engineering, The Pennsylvania State UniversityEmail verificata su psu.edu
- Katia BertoldiSEAS, Harvard UniversityEmail verificata su seas.harvard.edu
- Lichen FangApple Inc.Email verificata su jhu.edu
- Dr. Sicong ShanSchool of Engineering and Applied Sciences (SEAS), Harvard UniversityEmail verificata su seas.harvard.edu
- Pai WangUniversity of Utah; Harvard UniversityEmail verificata su utah.edu
- Philseok KimARPA-E, Department of EnergyEmail verificata su hq.doe.gov
- Santiago Orrego, Ph.D.Assistant Professor, Temple UniversityEmail verificata su temple.edu
- Krishna MandalDepartment of Electrical Engineering, University of South Carolina, Columbia, SC 29208, USAEmail verificata su cec.sc.edu
- Sindy KY TangAssociate Professor, Mechanical Engineering, Stanford UniversityEmail verificata su stanford.edu
- Boaz PokroyTechnion Israel Institute of TechnologyEmail verificata su technion.ac.il
- L MahadevanHarvard, Cambridge, MITEmail verificata su seas.harvard.edu
- James C. WeaverWyss Institute, Harvard UniversityEmail verificata su wyss.harvard.edu
- Jordan R. RaneyUniversity of PennsylvaniaEmail verificata su seas.upenn.edu
- Jennifer A. LewisHarvard UniversityEmail verificata su seas.harvard.edu
- Vladimir BulovicMassachusetts Institute of TechnologyEmail verificata su mit.edu
- Andrej KošmrljAssociate Professor of Mechanical and Aerospace Engineering, Princeton UniversityEmail verificata su princeton.edu
- Samuel ShianResearch Associate in Materials Science and Mechanical Engineering, Harvard UniversityEmail verificata su seas.harvard.edu
- Mikhail KatsElectrical and Computer Engineering, University of Wisconsin-MadisonEmail verificata su wisc.edu
- Darren J. LipomiDepartment of NanoEngineering, UC San DiegoEmail verificata su ucsd.edu