Общедоступные статьи - Tsung-Ching Jim HuangПодробнее...
2 статьи недоступны нигде
Multi-physics modeling and characterization of components on flexible substrates
S Sivapurapu, R Chen, C Mehta, Y Zhou, MLF Bellaredj, X Jia, PA Kohl, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (9 …, 2019
Финансирование: US Department of Defense
Multi-physics modeling characterization of aerosol jet printed transmission lines
S Sivapurapu, C Mehta, R Chen, X Jia, Y Zhou, M Bellaredj, PA Kohl, ...
2018 IEEE MTT-S International Conference on Numerical Electromagnetic and …, 2018
Финансирование: US Department of Defense
10 статей доступны в некоторых источниках
Biocompatible and totally disintegrable semiconducting polymer for ultrathin and ultralightweight transient electronics
T Lei, M Guan, J Liu, HC Lin, R Pfattner, L Shaw, AF McGuire, TC Huang, ...
Proceedings of the National Academy of Sciences 114 (20), 5107-5112, 2017
Финансирование: US Department of Energy, US Department of Defense
Low-voltage high-performance flexible digital and analog circuits based on ultrahigh-purity semiconducting carbon nanotubes
T Lei, LL Shao, YQ Zheng, G Pitner, G Fang, C Zhu, S Li, R Beausoleil, ...
Nature communications 10 (1), 2161, 2019
Финансирование: US National Science Foundation, US Department of Defense
The 2021 flexible and printed electronics roadmap
Y Bonnassieux, CJ Brabec, Y Cao, TB Carmichael, ML Chabinyc, ...
Flexible and printed electronics 6 (2), 023001, 2021
Финансирование: US Department of Defense, Chinese Academy of Sciences, National Natural …
Process design kit for flexible hybrid electronics
L Shao, TC Huang, T Lei, Z Bao, R Beausoleil, KT Cheng
2018 23rd Asia and South Pacific Design Automation Conference (ASP-DAC), 651-657, 2018
Финансирование: US Department of Defense
Compact modeling of thin-film transistors for flexible hybrid IoT design
L Shao, T Lei, TC Huang, S Li, TY Chu, M Wong, R Beausoleil, Z Bao, ...
IEEE Design & Test 36 (4), 6-14, 2019
Финансирование: Research Grants Council, Hong Kong
Process design kit and design automation for flexible hybrid electronics
TC Huang, T Lei, L Shao, S Sivapurapu, M Swaminathan, Z Bao, ...
Journal of Microelectronics and Electronic Packaging 16 (3), 117-123, 2019
Финансирование: US Department of Defense
Ultra-thin skin electronics for high quality and continuous skin-sensor-silicon interfacing
L Shao, S Li, T Lei, TC Huang, R Beausoleil, Z Bao, KT Cheng
Proceedings of the 56th Annual Design Automation Conference 2019, 1-6, 2019
Финансирование: US Department of Defense
Process design kit and design automation for flexible hybrid electronics
TC Huang, T Lei, L Shao, S Sivapurapu, M Swaminathan, Z Bao, ...
Journal of the Society for Information Display 28 (3), 241-251, 2020
Финансирование: US Department of Defense
Genetic variants in the ADD1 and GNB3 genes and blood pressure response to potassium supplementation
DH Yu, DP Liu, LY Wang, J Chen, CE Jaquish, DC Rao, JE Hixson, ...
Frontiers of Medicine in China 4, 59-66, 2010
Финансирование: US National Institutes of Health
16‐4: Invited Paper: Process Design Kit and Design Automation for Flexible Hybrid Electronics
TC Huang, T Lei, L Shao, S Sivapurapu, M Swaminathan, S Li, Z Bao, ...
SID Symposium Digest of Technical Papers 50 (1), 217-220, 2019
Финансирование: US Department of Defense
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