| A comprehensive review toward the state-of-the-art in failure and lifetime predictions of power electronic devices A Hanif, Y Yu, D DeVoto, F Khan IEEE Transactions on Power Electronics 34 (5), 4729-4746, 2018 | 197 | 2018 |
| A review of degradation behavior and modeling of capacitors A Gupta, OP Yadav, D DeVoto, J Major International Electronic Packaging Technical Conference and Exhibition 51920 …, 2018 | 94 | 2018 |
| Impact of accelerated stress-tests on SiC MOSFET precursor parameters JP Kozak, KDT Ngo, DJ DeVoto, JJ Major 2018 Second International Symposium on 3D Power Electronics Integration and …, 2018 | 34 | 2018 |
| Bond wire damage detection and SOH estimation of a dual-pack IGBT power module using active power cycling and reflectometry A Hanif, D DeVoto, F Khan IEEE Transactions on Power Electronics 35 (7), 6761-6772, 2019 | 29 | 2019 |
| Transient liquid phase bonding of AlN to AlSiC for durable power electronic packages DG Pahinkar, W Puckett, S Graham, L Boteler, D Ibitayo, S Narumanchi, ... Advanced Engineering Materials 20 (10), 1800039, 2018 | 28 | 2018 |
| Reliability of emerging bonded interface materials for large-area attachments PP Paret, DJ DeVoto, S Narumanchi IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (1 …, 2015 | 27 | 2015 |
| Characterization of contact and bulk thermal resistance of laminations for electric machines JE Cousineau, K Bennion, D DeVoto, M Mihalic, S Narumanchi National Renewable Energy Lab.(NREL), Golden, CO (United States), 2015 | 26 | 2015 |
| Gaining traction: thermal management and reliability of automotive electric traction-drive systems G Moreno, S Narumanchi, K Bennion, S Waye, D DeVoto IEEE Electrification Magazine 2 (2), 42-49, 2014 | 23 | 2014 |
| Trends in SiC MOSFET threshold voltage and on-resistance measurements from thermal cycling and electrical switching stresses JP Kozak, DJ DeVoto, JJ Major, KDT Ngo CIPS 2018; 10th International Conference on Integrated Power Electronics …, 2018 | 21 | 2018 |
| Experimental characterization and modeling of thermal resistance of electric machine lamination stacks JE Cousineau, K Bennion, D DeVoto, S Narumanchi International Journal of Heat and Mass Transfer 129, 152-159, 2019 | 20 | 2019 |
| Analysis and optimization of a multi-layer integrated organic substrate for high current GaN HEMT-based power module E Gurpinar, R Sahu, B Ozpineci, D DeVoto 2020 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia …, 2020 | 19 | 2020 |
| Degradation characterization of thermal interface greases D DeVoto, J Major, P Paret, GS Blackman, A Wong, JS Meth 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2017 | 19 | 2017 |
| Ultracompliant heterogeneous copper–tin nanowire arrays making a supersolder W Gong, P Li, Y Zhang, X Feng, J Major, D DeVoto, P Paret, C King, ... Nano letters 18 (6), 3586-3592, 2018 | 18 | 2018 |
| Reliability and lifetime prediction model of sintered silver under high-temperature cycling P Paret, J Major, D DeVoto, S Narumanchi, C Ding, GQ Lu IEEE Journal of Emerging and Selected Topics in Power Electronics 10 (5 …, 2021 | 17 | 2021 |
| Stress intensity of delamination in a sintered-silver interconnection DJ DeVoto, PP Paret, AA Wereszczak Additional Papers and Presentations 2014 (HITEC), 000190-000197, 2014 | 16 | 2014 |
| Liquid-cooled aluminum silicon carbide heat sinks for reliable power electronics packages DG Pahinkar, L Boteler, D Ibitayo, S Narumanchi, P Paret, D DeVoto, ... Journal of Electronic Packaging 141 (4), 041001, 2019 | 15 | 2019 |
| Thermal performance and reliability characterization of bonded interface materials (BIMs) D DeVoto, P Paret, M Mihalic, S Narumanchi, A Bar-Cohen, K Matin Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014 | 14 | 2014 |
| Investigation of thermal interface materials using phase-sensitive transient thermoreflectance technique X Feng, C King, D DeVoto, M Mihalic, S Narumanchi Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014 | 13 | 2014 |
| Reliability of bonded interfaces for automotive power electronics D DeVoto, P Paret, S Narumanchi, M Mihalic International Electronic Packaging Technical Conference and Exhibition 55751 …, 2013 | 13 | 2013 |
| Evaluation of low-pressure-sintered multi-layer substrates for medium-voltage SiC power modules J Gersh, C DiMarino, D DeVoto, P Paret, J Major, S Gage 2021 IEEE Applied Power Electronics Conference and Exposition (APEC), 20-26, 2021 | 11 | 2021 |