个人学术档案

Valerio Re

Professor of Electronics, University of Bergamo and INFN, Italy

在 unibg.it 的电子邮件经过验证

被引用次数：166615

Microelectronics low-noise electronics semiconductor detectors 3D integration particle physics

Hong-Bo Sun

Tsinghua University

在 tsinghua.edu.cn 的电子邮件经过验证

被引用次数：42610

photonic chips 3D integration laser precision manufacturing

Chris Bower

X Display Company, X-Celeprint, Semprius, RTI International, Bell Labs, UNC - Chapel Hill

在 xdisplay.com 的电子邮件经过验证

被引用次数：20822

3D Integration Advanced Packaging Assembly Technology Nanomaterials Micro-Transfer-Printing

Ratti Lodovico

Professor of Electronics, University of Pavia and INFN

在 unipv.it 的电子邮件经过验证

被引用次数：11066

Microelectronics low-noise front-end noise radiation tolerance 3D integration

Katsuyuki Sakuma

Manager, Principal Research Staff Member, IBM Thomas J. Watson Research Center

在 us.ibm.com 的电子邮件经过验证

被引用次数：3417

3D Integration Biomedical engineering System on Package Flip Chip Bonding

Andreas C Fischer

Ph.D. from KTH Royal Institute of Technology in Stockholm, Sweden

在 ee.kth.se 的电子邮件经过验证

被引用次数：3028

MEMS 3D integration 3D packaging 2-photon polymerization Additive Manufacturing

Steven E. Steen

IBM, ASML

在 asml.com 的电子邮件经过验证

被引用次数：2755

Lithography 3D integration semiconductors process photovoltaics

Ana Rusu

Professor of Electronic Circuits and Systems, KTH Royal Institute of Technology, EECS …

在 kth.se 的电子邮件经过验证

被引用次数：2719

energy-efficient circuits and systems energy harvesting emerging technologies 3D integration

Xiaoyu Sun

TSMC

在 tsmc.com 的电子邮件经过验证

被引用次数：2667

AI Hardware Accelerator Computer Architecture 3D Integration Memory Technology

Zhe Cheng

Peking University

在 pku.edu.cn 的电子邮件经过验证

被引用次数：2473

Thermal Management Microelectronics 3D Integration Interfaces

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