Chris Bower

Chris Bower

X Display Company, X-Celeprint, Semprius, RTI International, Bell Labs, UNC - Chapel Hill
在 xdisplay.com 的电子邮件经过验证
被引用次数：20833
3D Integration Advanced Packaging Assembly Technology Nanomaterials Micro-Transfer-Printing
Marko Švaco

Marko Švaco

Assistant professor, University of Zagreb, Faculty of Mechanical Engineering and Naval …
在 fsb.unizg.hr 的电子邮件经过验证
被引用次数：642
Robotics Robotic Surgery Artificial Intelligence Assembly Technology Industrial Automation
D. HIRATSUKA

D. HIRATSUKA

Toshiba Corp.
被引用次数：176
Assembly technology Ceramic processing science Power electronics
Dirk Seehase

Dirk Seehase

Researcher, University of Rostock
在 uni-rostock.de 的电子邮件经过验证
被引用次数：42
printed circuit boards solder joints embedding heating assembly technology