个人学术档案

Victor M. Bright

Professor of Mechanical Engineering, University of Colorado

在 colorado.edu 的电子邮件经过验证

被引用次数：11826

electronics packaging microsensors MEMS NEMS atomic-layer deposition (ALD)

Hafiz Waqas Ali

Dalian University of Technology

被引用次数：10575

electronics packaging IC reliability lead free solders renewable energy advanced materials

james drewniak

Missouri University of Science and Technology

在 mst.edu 的电子邮件经过验证

被引用次数：10550

Electromagnetic Compatibility Electronics Packaging Signal and Power Integrity

Bahgat G Sammakia

Binghamton University

在 binghamton.edu 的电子邮件经过验证

被引用次数：9763

Electronics packaging thermal sciences electronics cooling heat transfer

Mohd Faizul Mohd Sabri

Universiti Malaya

在 um.edu.my 的电子邮件经过验证

被引用次数：6641

Thermoelectric Electronics packaging Micro/Nano devices MEMS

Takafumi Fukushima

Associate Procfessor, Tohoku University

在 lbc.mech.tohoku.ac.jp 的电子邮件经过验证

被引用次数：5140

Electronics Packaging 3D IC Micro/Nano/Self-Assemby DSA Polymer Technologies

Chris Bailey

Arizona State University

在 asu.edu 的电子邮件经过验证

被引用次数：4717

Electronics Packaging Multi-Physics Modelling Reliability

Willem G. Odendaal

Associate Professor of Electrical and Computer Engineering, Virginia Tech

在 vt.edu 的电子邮件经过验证

被引用次数：4620

power electronics pulse power electromagnetics electronics packaging

Eiji Higurashi

Tohoku University

在 tohoku.ac.jp 的电子邮件经过验证

被引用次数：4071

Electronics Packaging Low Temperature Bonding Sensors and MEMS

Kim S Siow

Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia …

在 ukm.edu.my 的电子邮件经过验证

被引用次数：3830

sintered silver electronics packaging mechanical behavior of materials plasma treatment

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