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- Jian "Javen" LinAssociate Professor of Mechanical and Aerospace Engineering at University of Missouri-Columbia在 missouri.edu 的电子邮件经过验证
- Chi ZhangHangzhou Institute for Advanced Study在 ucas.ac.cn 的电子邮件经过验证
- Heng DengChina University of Geosciences(Wuhan)在 cug.edu.cn 的电子邮件经过验证
- Jheng-Wun SuSlippery Rock University of Pennsylvania在 sru.edu 的电子邮件经过验证
- Cheng ZhangCollege of Engineering, Nanjing Agricultural University在 njau.edu.cn 的电子邮件经过验证
- Zheng YanUniversity of Missouri-Columbia在 missouri.edu 的电子邮件经过验证
- Yuan DongDepartment of mechanical engineering, University of Missouri在 missouri.edu 的电子邮件经过验证
- Xiaoqing HeUniversity of Missouri-Columbia在 missouri.edu 的电子邮件经过验证
- Travis TumlinSony DADC; U.S. Army Research Laboratory; University of Missouri在 mail.missouri.edu 的电子邮件经过验证
- Mark H GriepU.S. Army Research Laboratory在 mtu.edu 的电子邮件经过验证
- Tommi WhiteBayer Crop Science & University of Missouri在 missouri.edu 的电子邮件经过验证
- John Derek DemareeMaterials Engineer, DEVCOM Army Research Laboratory在 army.mil 的电子邮件经过验证
- Thomas C ParkerUS Army Research Lab在 us.army.mil 的电子邮件经过验证
- Xuefeng HuShaanxi University of Science and Technology